Chroma 7940 wafer chip inspection system is an automated inspection system for post-diced wafer chip inspection. It is capable of inspecting both top and bottom view of the wafer chip simultaneously. Utilizing an advanced illumination technology and color camera acquisition, the system can be customized for various wafer processes and test configuration such as vertical chip or flip chip inspection.
With high-speed camera and inspection algorithms, Chroma 7940 can inspect up to 6" wafer in 3 minutes with a throughput of up to 15 msec./chip. It provides auto focus and compensation for wafer warpage and leveling of an uneven chuck. 2X, 5X and 10X magnifications with 1.30μm/pixel, 0.50μm/pixel and 0.25μm/pixel resolutions respectively are used to detect various defects below 1.0μm in size.
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