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Master Bond
154 Hobart St
Hackensack, NJ 07601
United States

Year Founded: 1976
Key Personnel: VP Technical Sales: Robert Michaels
Phone: 201-343-8983
Fax: 201-343-2132

Master Bond

Master Bond formulates high quality, innovative compounds for the laser, optics and photonics industries. Our goal is to help engineers meet specific requirements for their bonding, sealing and coating applications.

Key Benefits of Master Bond Adhesives, Sealants and Coatings

Master Bond’s wide-ranging product line of epoxies, silicones, UV curable and LED curable systems are reliable, come in convenient packaging and feature outstanding performance properties.  Each compound is designed to meet specific application needs and requirements, such as: 

  • Low outgassing
  • Low stress
  • Optical clarity
  • Non-yellowing
  • High bond strength
  • Chemical resistance
  • Electrical properties

In addition to outstanding optical properties, special grades of Master Bond epoxy adhesives and UV curable systems feature exceptional thermal, electrical and mechanical characteristics for electro-optical and fiber-optic applications. These products provide strong, durable bonds to a wide variety of similar and dissimilar substrates. Specific compounds vary in viscosity, cure speed, chemical resistance and electrical properties, and can be custom formulated to meet the needs of your specific application.

 Expert Technical Support

Our experienced appllication engineers provide individual support to help determine the best adhesive for your application.

Master Bond EP21TDCS-LO is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated ... View Product
Master Bond LED401 is a unique single component compound that cures rapidly upon exposure to 405 nm light. This formulation has a low viscosity, high bond strength and superior electrical insulation p... View Product
Master Bond UV10TKLO-2 is a special one component UV curable epoxy modified system for high performance bonding, sealing and encapsulation. This system can be cured in thicker sections, up to 1/16 of ... View Product