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    LECC Technology Co Ltd

    LECC is committed to the development and manufacture of mid-to-high-end laser modules. We value every industry's imagination of laser technology. Not afraid of development challenges...

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    Featured Content

    Marktech30i Metal Laser Engraver
    Packaging/Assembly Equipment

    Handheld Fiber Laser MarkTech30i Portable Laser Engraver

    Metal Laser Engraver
    The MarkTech30i is a Handheld Fiber Laser that performs as a Portable Laser Engraver and Laser Etcher, with built-in safety marking shield/cone. Perfect for any task requiring...
    Sst 8301 Left Side 900
    Packaging/Assembly Equipment

    SST 8300 Automated Vacuum Pressure Soldering System

    Palomar Technologies Inc
    The SST 8300 Series is an automated vacuum pressure soldering system for flux-less soldering by providing highly reliable and reproducible solder interfaces using precise combination...
    Sst 3150 Left Side 1
    Packaging/Assembly Equipment

    SST 3150 High Vacuum Furnace

    Palomar Technologies Inc
    The SST 3150 is designed to create high reliability MEMS packages. Packages are hermetically sealed with very low vacuum and moisture levels for extended, long-term performance...
    Palomar 8100 Wire Bonder
    Packaging/Assembly Equipment

    Palomar 8100 Fine Wire Bonder/Ball Bumper

    Palomar Technologies Inc
    The newest Palomar fully automated, thermosonic high-speed, ball-and-stitch fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven...
    6532hp Machinethree Quarter View8022brev1 Cropped
    Packaging/Assembly Equipment

    Palomar 6532 Die Bonder

    Palomar Technologies Inc
    The Palomar 6532HP is a high performance die bonder designed for the precise and high volume device assembly requirements of the photonics market. Combining a high volume presentation...
    3880 With Handlers Left Side
    Packaging/Assembly Equipment

    Palomar 3880 Die Bonder

    Palomar Technologies Inc
    Die Bonder Flexibility for Next Generation Photonics Packaging: Palomar Technologies’ 3880 Die Bonder provides the flexibility and versatility to handle the many challenges present...
    Epic July202026
    Packaging/Assembly Equipment

    Bay Photonics Targets Fine Pitch Placement of Flip-Chip Photonics Devices Utilizing Palomar 3880 Die Bonder

    Palomar Technologies Inc
    Carlsbad, CA – February 4, 2021 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced...
    Epic July202036 900x621
    Packaging/Assembly Equipment

    Electronics and Photonics Innovation Center (EPIC) Purchases Palomar 3880 Die Bonder for Expanded Packaging Research

    Palomar Technologies Inc
    Carlsbad, CA – December 21, 2020 – Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced...
    Palomar 8100front Profile
    Packaging/Assembly Equipment

    Palomar Technologies new 8100 Wire Bonder Increases Productivity and Efficiency

    Palomar Technologies Inc
    Carlsbad, CA – Sept 29, 2020 – Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging today announced the...
    Screen Shot 2021 03 26 At 3 08 28 Pm
    Packaging/Assembly Equipment

    Laser Glass Processing Machine by AdValue Photonics

    AdValue Photonics
    TUCSON, Ariz., Jan. 20, 2021 /PRNewswire/ -- AdValue Photonics, Inc. (Tucson, AZ) is pleased to introduce a laser glass processing machine to drill, cut, mark, and mill glass ...

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